Radojcic, Riko: search on Z-Library

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1

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip Package Interaction

Sukharev, Valeriy, Choy, Jun-Ho, Kteyan, Armen, Hovsepyan, Henrik, Nakamoto, Mark, Zhao, Wei, Radojcic, Riko, Muehle, Uwe, Zschech, Ehrenfried

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 2.73 MB

english, 2017

2

More-than-Moore 2.5D and 3D SiP Integration ||

Year:

2017

Language:

english

File:

PDF, 6.59 MB

english, 2017

3

Semiconductor device reliability vs process quality

Riko Radojcic, Paul Giotta

Journal:

Microelectronics Reliability

Year:

1992

Language:

english

File:

PDF, 380 KB

english, 1992

4

[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

Sukharev, Valeriy, Choy, Jun-Ho, Kteyan, Armen, Hovsepyan, Henrik, Muehle, Uwe, Zschech, Ehrenfried, Radojcic, Riko

Year:

2016

Language:

english

File:

PDF, 3.36 MB

english, 2016

5

Analysis of the Effect of TSV-induced Stress on Devices Performance by Direct Strain and Electrical Measurements and FEA Simulations

Kteyan, Armen, Muehle, Uwe, Gall, Martin, Sukharev, Valeriy, Radojcic, Riko, Zschech, Ehrenfried

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2017

Language:

english

File:

PDF, 2.31 MB

english, 2017

6

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Simulation methodology and flow integration for 3D IC stress management

Nakamoto, Mark, Radojcic, Riko, Wei Zhao,, Dasarapu, Vinay K., Karmarkar, Aditya P., Xu, Xiaopeng

Year:

2010

Language:

english

File:

PDF, 473 KB

english, 2010

7

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Multi-die chip on wafer thermo-compression bonding using non-conductive film

Hiner, David, Kim, Dong Wook, Ahn, SeokGeun, Kim, KeunSoo, Kim, HwanKyu, Lee, MinJae, Kang, DaeByoung, Kelly, Michael, Huemoeller, Ron, Radojcic, Riko, Gu, Sam

Year:

2015

Language:

english

File:

PDF, 893 KB

english, 2015

8

[IEEE 2009 International Symposium on System-on-Chip - SOC - Tampere, Finland (2009.10.5-2009.10.7)] 2009 International Symposium on System-on-Chip - Pathfinding: A design methodology for fast exploration and optimisation of 3D-stacked integrated circuits

Milojevic, Dragomir, Radojcic, Riko, Carpenter, Roger, Marchal, Pol

Year:

2009

Language:

english

File:

PDF, 617 KB

english, 2009

9

[IEEE Tutorial (ICICDT) - Grenoble, France (2008.06.2-2008.06.4)] 2008 IEEE International Conference on Integrated Circuit Design and Technology and Tutorial - Virtual design for technology exploration - a process design integration methodology for a fabless entity -

Chun, Christopher, Corleto, Jose, Nowak, Matt, Radojcic, Riko

Year:

2008

Language:

english

File:

PDF, 319 KB

english, 2008

10

Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs

Wu, Xiaoxia, Zhao, Wei, Nakamoto, Mark, Nimmagadda, Chandra, Lisk, Durodami, Gu, Sam, Radojcic, Riko, Nowak, Matt, Xie, Yuan

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2012

Language:

english

File:

PDF, 1.04 MB

english, 2012

11

[IEEE 2007 International Symposium on Integrated Circuits - Singapore (2007.09.26-2007.09.28)] 2007 International Symposium on Integrated Circuits - CMP Model Based RC Extraction

Liao, Hongmei, Song, Li, Jakatdar, Nickhil, Radojcic, Riko

Year:

2007

Language:

english

File:

PDF, 2.22 MB

english, 2007

12

More-than-Moore 2.5D and 3D SiP Integration || More-than-Moore Technology Opportunities: 2.5D SiP

Year:

2017

Language:

english

File:

PDF, 2.97 MB

english, 2017

13

[ACM Press the 46th Annual Design Automation Conference - San Francisco, California (2009.07.26-2009.07.31)] Proceedings of the 46th Annual Design Automation Conference on ZZZ - DAC '09 - Moore's Law

Cong, Jason, Nagaraj, N. S., Puri, Ruchir, Joyner, William, Burns, Jeff, Gavrielov, Moshe, Radojcic, Riko, Rickert, Peter, Stork, Hans

Year:

2009

Language:

english

File:

PDF, 59 KB

english, 2009

14

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study

Milojevic, Dragomir, Carlson, Trevor E., Croes, Kris, Radojcic, Riko, Ragett, Diana F., Seynhaeve, Dirk, Angiolini, Federico, Van der Plas, Geert, Marchal, Pol

Year:

2009

Language:

english

File:

PDF, 799 KB

english, 2009

15

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Mechanical stress management for electrical chip-package interaction (e-CPI)

Zhao, Wei, Nakamoto, Mark, Ramachandran, Vidhya, Radojcic, Riko

Year:

2014

Language:

english

File:

PDF, 864 KB

english, 2014

16

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Enabling power distribution network analysis flows for 3D ICs

Hu, Xiang, Toms, Thomas, Radojcic, Riko, Nowak, Matt, Yu, Nick, Cheng, Chung-Kuan

Year:

2010

Language:

english

File:

PDF, 96 KB

english, 2010

17

[ACM Press the 42nd annual conference - San Diego, California, USA (2005.06.13-2005.06.17)] Proceedings of the 42nd annual conference on Design automation - DAC '05 - Are there economic benefits in DFM?

Nowak, Matt, Radojcic, Riko

Year:

2005

Language:

english

File:

PDF, 129 KB

english, 2005

18

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - First demonstration of drop-test reliability of ultra-thin glass BGA packages directly assembled on boards for smartphone applications

Singh, Bhupender, Smet, Vanessa, Lee, Jaesik, Menezes, Gary, Kobayashi, Makoto, Raj, Pulugurtha Markondeya, Sundaram, Venky, Roggeman, Brian, Ray, Urmi, Radojcic, Riko, Tummala, Rao

Year:

2015

Language:

english

File:

PDF, 1.56 MB

english, 2015

19

[ACM Press the 45th annual conference - Anaheim, California (2008.06.08-2008.06.13)] Proceedings of the 45th annual conference on Design automation - DAC '08 - Holistic pathfinding

Nowak, Matt, Corleto, Jose, Chun, Christopher, Radojcic, Riko

Year:

2008

Language:

english

File:

PDF, 310 KB

english, 2008

20

[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - A complete stress enhancement model development and verification platform for 32nm technology and beyond

Li, Yanfeng, Zhu, Nengyong, Li, Miao, Wu, Yanjun, Chen, Qiang, Shuang Cai,, Radojcic, Riko, Nakamoto, Mark

Year:

2010

Language:

english

File:

PDF, 478 KB

english, 2010

21

[ACM Press the 50th Annual Design Automation Conference - Austin, Texas (2013.05.29-2013.06.07)] Proceedings of the 50th Annual Design Automation Conference on - DAC '13 - Power and signal integrity challenges in 3D systems

Corbalan, Miguel Miranda, Keval, Anup, Toms, Thomas, Lisk, Durodami, Radojcic, Riko, Nowak, Matt

Year:

2013

Language:

english

File:

PDF, 451 KB

english, 2013

22

Three Dimensional System Integration || Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs

Papanikolaou, Antonis, Soudris, Dimitrios, Radojcic, Riko

Year:

2011

Language:

english

File:

PDF, 3.90 MB

english, 2011

23

[ACM Press the 47th Design Automation Conference - Anaheim, California (2010.06.13-2010.06.18)] Proceedings of the 47th Design Automation Conference on - DAC '10 - 3-D stacked die

Bansal, Samta, Rey, Juan C., Yang, Andrew, Jang, Myung-Soo, Lu, LC, Magarshack, Philippe, Pol, Marchal, Radojcic, Riko

Year:

2010

Language:

english

File:

PDF, 154 KB

english, 2010

24

AIP Conference Proceedings [AIP STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias - Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany (March 16, 2010 - July 13, 2010 - October 20, 2010)] - TechTuning: Stress Management For 3D Through-Silicon-Via Stacking Technologies

Radojcic, Riko, Nowak, Matt, Nakamoto, Mark

Year:

2011

Language:

english

File:

PDF, 2.81 MB

english, 2011

25

[IEEE 2007 IEEE Custom Integrated Circuits Conference - San Jose, CA, USA (2007.09.16-2007.09.19)] 2007 IEEE Custom Integrated Circuits Conference - Integration of CMP Modeling in RC Extraction and Timing Flow

Liao, Hongmei, Song, Li, Jakatdar, Nickhil, Radojcic, Riko

Year:

2007

Language:

english

File:

PDF, 345 KB

english, 2007

26

[IEEE 2012 IEEE Hot Chips 24 Symposium (HCS) - Cupertino, CA, USA (2012.8.27-2012.8.29)] 2012 IEEE Hot Chips 24 Symposium (HCS) - Roadmap for design and EDA infrastructure for 3D products

Year:

2012

Language:

english

File:

PDF, 3.03 MB

english, 2012

27

AIP Conference Proceedings [AIP STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias - Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany (March 16, 2010 - July 13, 2010 - October 20, 2010)] - PREFACE

Zschech, Ehrenfried, Radojcic, Riko, Sukharev, Valeriy, Smith, Larry

Year:

2011

File:

PDF, 382 KB

2011

28

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Development of 3D through silicon stack (TSS) assembly for wide IO memory to logic devices integration

Kim, Dong Wook, Vidhya, Ramachandran, Henderson, Brian, Ray, Urmi, Gu, Sam, Zhao, Wei, Radojcic, Riko, Nowak, Matt

Year:

2013

Language:

english

File:

PDF, 1.57 MB

english, 2013

29

[IEEE 2012 IEEE International Conference on IC Design & Technology (ICICDT) - Austin, TX, USA (2012.05.30-2012.06.1)] 2012 IEEE International Conference on IC Design & Technology - 3D stacking: Where the rubber meets the road

Nimmagadda, Chandra, Lisk, Durodami, Radojcic, Riko

Year:

2012

Language:

english

File:

PDF, 484 KB

english, 2012

30

AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Stress management for 3D through-silicon-via stacking technologies - The next frontier -

Radojcic, Riko, Nowak, Matt, Nakamoto, Mark

Year:

2014

Language:

english

File:

PDF, 1.02 MB

english, 2014

31

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Design-for-stress for CMOS technologies - the next frontier

Year:

2016

File:

PDF, 134 KB

2016

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